• DocumentCode
    2513492
  • Title

    An Optimized Anonymous Attestation Protocol from Bilinear Pairing

  • Author

    Yu, Rongwei ; Wang, Lina ; Zhou, Yanzhou ; Niu, Xianhui

  • Author_Institution
    Sch. of Comput., Wuhan Univ., Wuhan, China
  • fYear
    2009
  • fDate
    25-27 Sept. 2009
  • Firstpage
    424
  • Lastpage
    428
  • Abstract
    With the development of Internet-based computing, we can no longer trust them to sustain the applications we depend on because IT infrastructure technologies fail to keep pace with emerging threats. Direct Anonymous Attestation (DAA) enables remote authentication of a user while preserving privacy under the user´s control. The existing protocols for direct anonymous attestation of Trusted Platform Module (TPM) with limited storage space and communication capability could not satisfy the higher requirements of performance and security. From bilinear pairings, this paper proposes an optimized DAA protocol. The analysis result of the proposed protocol shows that cost of TPM remains lower than the BCL-DAA scheme and the computational cost of host and verifier are highly reduced. Furthermore, the proposed scheme is secure in the random oracle model under the l-MOMSDH assumption.
  • Keywords
    Internet; data privacy; message authentication; optimisation; protocols; Internet-based computing; bilinear pairing; computational cost; data privacy; direct anonymous attestation; optimized anonymous attestation protocol; random oracle model; remote authentication; trusted platform module; Authentication; Communication system control; Computational efficiency; Costs; Internet; Privacy; Protocols; Secure storage; Security; Space technology; TPM; remote attestation; trusted computing; virtual machine;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Scalable Computing and Communications; Eighth International Conference on Embedded Computing, 2009. SCALCOM-EMBEDDEDCOM'09. International Conference on
  • Conference_Location
    Dalian
  • Print_ISBN
    978-0-7695-3825-9
  • Type

    conf

  • DOI
    10.1109/EmbeddedCom-ScalCom.2009.82
  • Filename
    5341733