Investigation of the shielding on the mobile phone PCB using FDTD

The coupling mechanisms between the active traces and a victim trace with two victim ports on a real phone PCB model was investigated with FDTD simulation in this paper. The studied scenarios include the PCB with a full shielding, perforated shielding and no shielding. Firstly, the coupling performance of the real phone PCB was reproduced with numerical simulations. According to the simulation results, a simplified PCB model was developed based on the real phone PCB to study the coupling mechanisms with no shielding and different geometries of the shielding, including the dimensions and perforated shielding. The understanding from the investigation were applied to interpret the performance in the real phone PCB.