Quick prototyping of flip chip assembly with MEMS

Author

Irwin, Ronda ; Zhang, Wenge ; Harsh, Kevin ; Lee, Y.C.

Author_Institution

Colorado Univ., Boulder, CO, USA

fYear

1998

fDate

9-12 Aug 1998

Firstpage

293

Lastpage

296

Abstract

This paper describes a process to transfer microelectromechanical systems (MEMS) devices to a secondary substrate using flip-chip thermosonic bonding. A standard wire-bonding machine was used to place ~100-μm bumps on unreleased MEMS chiplets. The bumped chiplet was then flip-chip bonded to a secondary substrate containing a microwave coplanar waveguide (CPW). After bonding, the entire assembly was run through the MEMS release process, after which the MEMS host substrate was removed. The thermosonic bonding was a very reliable prototyping tool with a 100% bonding yield. The transfer process can be used with any MEMS that can be wire bonded. The process can also be applied to a variety of applications

Keywords

coplanar waveguides; flip-chip devices; lead bonding; micromechanical devices; MEMS chiplets; bonding yield; flip chip assembly; flip-chip thermosonic bonding; microelectromechanical systems; microwave coplanar waveguide; quick prototyping; release process; reliable prototyping tool; secondary substrate; transfer process; wire-bonding machine; Assembly; Bonding; Capacitance measurement; Capacitors; Flip chip; Microelectromechanical devices; Microelectromechanical systems; Micromechanical devices; Prototypes; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio and Wireless Conference, 1998. RAWCON 98. 1998 IEEE

Conference_Location

Colorado Springs, CO

Print_ISBN

0-7803-4988-1

Type

conf

DOI

10.1109/RAWCON.1998.709194

Filename

709194