Title :
Trends in mixed signal RF and integrated microsystems
Author :
Perlman, Barry S.
Author_Institution :
Technology, Communications-Electronics R&DE Center, U.S. Army Research, Development and Engineering Command, USA
Abstract :
Integrated mixed signal electronics combining analog, digital and radio frequency circuits is being used to realize beyond-leading-edge components and systems on a chip with revolutionary performance and high levels of functionality. This talk will provide an overview of integrated microsystem development and associated material and device technology. Specific examples will include reconfigurable radio frequency circuit and device technology, heterogeneous integrated circuits, multiresolution spectral sensors, intelligent microsystems and integrated microsystems for digital beamformers. This technology is pushing the limits of conventional scaling, integration, linearity and power dissipation and is changing the paradigm of a variety of systems by making it possible to improve data throughput and connectivity by enabling autonomous reconfigurability, spectral and temporal agility and adaptive behaviour.
Keywords :
mixed analogue-digital integrated circuits; radiofrequency integrated circuits; analog circuits; digital beamformer; digital circuits; heterogeneous integrated circuits; integrated microsystem; integrated mixed signal electronics; intelligent microsystem; mixed signal RF system; multiresolution spectral sensors; power dissipation; reconfigurable radiofrequency circuits; reconfigurable radiofrequency device technology; Digital integrated circuits; Integrated circuit technology; Intelligent sensors; Linearity; Power dissipation; RF signals; Radio frequency; Radiofrequency integrated circuits; Signal resolution; Software radio;
Conference_Titel :
Recent Advances in Microwave Theory and Applications, 2008. MICROWAVE 2008. International Conference on
Conference_Location :
Jaipur
Print_ISBN :
978-1-4244-2690-4
Electronic_ISBN :
978-1-4244-2691-1
DOI :
10.1109/AMTA.2008.4763241
