DocumentCode :
2515200
Title :
In-situ EMC testing using surface current sense wires
Author :
Coenen, Mart ; Maas, Tim ; Hu, Yili ; Van Roermund, Arthur
Author_Institution :
EMCMCC bv, Eindhoven, Netherlands
fYear :
2010
fDate :
12-16 April 2010
Firstpage :
586
Lastpage :
589
Abstract :
In-situ EMC testing is, for large fixed systems and installations within the scope of the European EMC Directive, not a primary requirement other than unintended RF emissions may not affect intended radio frequency communication services, like the requirements of IEC/EN 55011 outside the end-user´s premises. Whatever happens on the premises of the industrial end-user is a matter of negotiations and agreements between the various system suppliers and the end-user, in particular when EMC is lacking between two or more (sub-) systems installed. A formal standardized method for verification is IEC CISPR/TR 16-2-5 Ed. 1.0, but one of the root problems is the usage of common EMC measurement antenna nearby a conductive object, when performing in-situ EMC investigations, which remains doubtful. In a pan-European TEMCA-2 (ended 2007) project several investigations have been carried out which have not (yet) resulted in a standardized test method but their results have been reported at several international symposia. In this paper, part of an adapted in-situ measurement approach is presented which minimizes the interaction with the local EM-environment even further by using surface current sense wires. This new test method has already been submitted as NP to the international standardization bodies concerned.
Keywords :
IEC standards; electromagnetic compatibility; EMC measurement antenna; IEC CISPR/TR 16-2-5 Ed. 1.0; IEC/EN 55011; conductive object; formal standardized method; in-situ EMC testing; radio frequency communication services; surface current sense wires; Antenna measurements; Conductivity measurement; Conferences; Current measurement; Electromagnetic compatibility; IEC standards; Performance evaluation; Radio frequency; System testing; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-5621-5
Type :
conf
DOI :
10.1109/APEMC.2010.5475752
Filename :
5475752
Link To Document :
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