DocumentCode
251537
Title
Analysis and Simulation of temperature-current rise in modern PCB traces
Author
Petrosyants, Konstantin ; Kortunov, Artur ; Kharitonov, Igor ; Popov, Anton ; Gomanilova, Natalya ; Rjabov, Nikita
Author_Institution
Higher Sch. of Econ., Moscow Inst. of Electron. & Math. of Nat. Res. Univ., Moscow, Russia
fYear
2014
fDate
26-29 Sept. 2014
Firstpage
1
Lastpage
4
Abstract
The temperature-current rise in modern (up to 100-150 microns wide) PCB traces is simulated using three software tools ANSYS, HyperLynxThermal and ELCUT. The results are compared with the IR measurements in PCB copper traces with different sizes and substrate materials. It is shown that ANSYS correctly describes the thermal behavior for all tests, other tools have some limitations for small size traces.
Keywords
printed circuit design; printed circuit testing; printed circuits; ANSYS; ELCUT; HyperLynxThermal; modern PCB traces; temperature-current rise; thermal behavior; Analytical models; Copper; Current measurement; Finite element analysis; Simulation; Substrates; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Design & Test Symposium (EWDTS), 2014 East-West
Conference_Location
Kiev
Type
conf
DOI
10.1109/EWDTS.2014.7027054
Filename
7027054
Link To Document