Title :
Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits
Abstract :
The following topics were covered: building-in reliability; failure analysis techniques; packaging; electrostatic discharge; hot carriers; oxide reliability; semiconductor IC reliability; and failure mechanisms
Keywords :
dielectric thin films; electric breakdown; electrostatic discharge; failure analysis; hot carriers; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; monolithic integrated circuits; ESD; electrostatic discharge; failure analysis techniques; failure mechanisms; hot carriers; oxide reliability; packaging; semiconductor IC reliability;
Conference_Titel :
Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on
Conference_Location :
Singapore
Print_ISBN :
0-7803-3985-1
DOI :
10.1109/IPFA.1997.638062
