DocumentCode
2516039
Title
Constant time interval production planning with application to WIP control in semiconductor fabrication
Author
Miyashita, Kazuo ; Senoh, Kazuyuki ; Ozaki, Hiroyuki ; Matsuo, Huofumi
Author_Institution
Nat. Inst. of Adv. Ind. Sci. & Technol., Ibaraki, Japan
Volume
2
fYear
2003
fDate
7-10 Dec. 2003
Firstpage
1329
Abstract
We develop a constant time interval production planning and control methodology, called CONSTIN, and its associated simulation system for a large-scale and unstable semiconductor manufacturing process. CONSTIN moves work-in-process inventories (WIP) between processes only at a constant time interval, and consequently maintains a desirable level of WIP. Our theoretical and experimental analysis shows a clear relationship between WIP levels and the time interval in CONSTIN. Computational experiments with realistic wafer fabrication process data demonstrate that CONSTIN is comparable in simulation accuracy to a popular event-driven simulator and can run much faster. Additional experiments also manifest that, with appropriate control rules, CONSTIN can restore the desired levels of WIP from extreme deviations and maintain them. Therefore, we conclude that CONSTIN is a promising methodology of production planning and WIP control for the semiconductor manufacturing process.
Keywords
discrete event simulation; integrated circuit manufacture; manufacturing processes; production planning; wafer bonding; work in progress; WIP control; constant time interval production planning; event-driven simulator; large-scale semiconductor manufacturing process; realistic wafer fabrication process; semiconductor fabrication; unstable semiconductor manufacturing process; work-in-process inventories; Computational modeling; Discrete event simulation; Fabrication; Large-scale systems; Lead compounds; Manufacturing industries; Manufacturing processes; Production planning; Semiconductor device manufacture; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation Conference, 2003. Proceedings of the 2003 Winter
Print_ISBN
0-7803-8131-9
Type
conf
DOI
10.1109/WSC.2003.1261569
Filename
1261569
Link To Document