DocumentCode
2516271
Title
Application of cluster tool modeling to a 300 mm fab simulation
Author
Shikalgar, Sameer T. ; Fronckowiak, David ; MacNair, Edward A.
Author_Institution
IBM Microelectron. Div., East Fishkill, NY, USA
Volume
2
fYear
2003
fDate
7-10 Dec. 2003
Firstpage
1394
Abstract
300 mm semiconductor wafer fabrication facilities, like conventional semiconductor fabs, contain many different types of tools. We discuss a realistic way of representing cluster tools in a simulation model of the entire line. A more realistic representation of cluster tools results in greater accuracy in the output of the simulation model.
Keywords
cluster tools; digital simulation; semiconductor device manufacture; wafer-scale integration; 300 mm semiconductor wafer fabrication; cluster tool modeling; conventional semiconductor fab simulation; Fabrication; Microelectronics; Pipelines; Preventive maintenance; Robotics and automation; Robots; Semiconductor device modeling; Statistics;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation Conference, 2003. Proceedings of the 2003 Winter
Print_ISBN
0-7803-8131-9
Type
conf
DOI
10.1109/WSC.2003.1261581
Filename
1261581
Link To Document