DocumentCode
2516368
Title
Total dose radiation effects in partially-depleted SOI transistors with ultrathin gate oxide
Author
Jun, B. ; Fouillat, M. ; Schrimpf, R.D. ; Fleetwood, D.M. ; Cristoloveanu, S.
Author_Institution
Dept. of Electr. Eng., Vanderbilt Univ., Nashville, TN, USA
fYear
2004
fDate
4-7 Oct. 2004
Firstpage
30
Lastpage
31
Abstract
In this article, total dose effects on thin gate oxide, partially depleted SOI transistors are presented. The thin gate oxide is minimally affected by the radiation, while trapped holes in the buried oxide suppress the second gm peak by reducing the float body volume. Ultrathin tunneling oxides enable GIFBE and render the front channel of partially depleted transistors more sensitive to carrier trapping in the BOX. The devices recover during isochronal annealing, approaching the pre-irradiation characteristics at temperatures near 300 °C.
Keywords
MOSFET; annealing; buried layers; elemental semiconductors; radiation effects; silicon-on-insulator; tunnelling; 300 degC; Si; buried oxide; carrier trap; gate induced floating body effects; isochronal annealing; partially-depleted SOI transistors; radiation dose effects; trapped holes; ultrathin gate oxide; ultrathin tunneling oxides; Annealing; Electron traps; Leakage current; MOS devices; MOSFETs; Radiation effects; Region 2; Testing; Threshold voltage; Transconductance;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 2004. Proceedings. 2004 IEEE International
Print_ISBN
0-7803-8497-0
Type
conf
DOI
10.1109/SOI.2004.1391541
Filename
1391541
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