• DocumentCode
    2516368
  • Title

    Total dose radiation effects in partially-depleted SOI transistors with ultrathin gate oxide

  • Author

    Jun, B. ; Fouillat, M. ; Schrimpf, R.D. ; Fleetwood, D.M. ; Cristoloveanu, S.

  • Author_Institution
    Dept. of Electr. Eng., Vanderbilt Univ., Nashville, TN, USA
  • fYear
    2004
  • fDate
    4-7 Oct. 2004
  • Firstpage
    30
  • Lastpage
    31
  • Abstract
    In this article, total dose effects on thin gate oxide, partially depleted SOI transistors are presented. The thin gate oxide is minimally affected by the radiation, while trapped holes in the buried oxide suppress the second gm peak by reducing the float body volume. Ultrathin tunneling oxides enable GIFBE and render the front channel of partially depleted transistors more sensitive to carrier trapping in the BOX. The devices recover during isochronal annealing, approaching the pre-irradiation characteristics at temperatures near 300 °C.
  • Keywords
    MOSFET; annealing; buried layers; elemental semiconductors; radiation effects; silicon-on-insulator; tunnelling; 300 degC; Si; buried oxide; carrier trap; gate induced floating body effects; isochronal annealing; partially-depleted SOI transistors; radiation dose effects; trapped holes; ultrathin gate oxide; ultrathin tunneling oxides; Annealing; Electron traps; Leakage current; MOS devices; MOSFETs; Radiation effects; Region 2; Testing; Threshold voltage; Transconductance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 2004. Proceedings. 2004 IEEE International
  • Print_ISBN
    0-7803-8497-0
  • Type

    conf

  • DOI
    10.1109/SOI.2004.1391541
  • Filename
    1391541