Title :
Planar pin grid array (PGA) ceramic packaging
Author :
Phillips, George C., Jr.
Author_Institution :
IBM Corp., Endicott, NY, USA
Abstract :
A planar ceramic packaging is described. Both thick- and thin-film pin-grid arrays are considered. The properties of ceramic materials that are necessary for electronic applications are presented and the requirements for the substrates used for these packages are described. Future trends for these planar ceramic designs are examined
Keywords :
ceramics; integrated circuit technology; packaging; PGA; planar pin grid array ceramic packaging; substrates; thick-film pin grid array; thin-film pin-grid arrays; Ceramics; Conducting materials; Electrodes; Electronics packaging; Glass; Metallization; Resistors; Sputtering; Substrates; Thin film circuits;
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA
DOI :
10.1109/ECC.1988.12616
