DocumentCode
2516669
Title
Planar pin grid array (PGA) ceramic packaging
Author
Phillips, George C., Jr.
Author_Institution
IBM Corp., Endicott, NY, USA
fYear
1988
fDate
9-11 May 1988
Firstpage
350
Lastpage
354
Abstract
A planar ceramic packaging is described. Both thick- and thin-film pin-grid arrays are considered. The properties of ceramic materials that are necessary for electronic applications are presented and the requirements for the substrates used for these packages are described. Future trends for these planar ceramic designs are examined
Keywords
ceramics; integrated circuit technology; packaging; PGA; planar pin grid array ceramic packaging; substrates; thick-film pin grid array; thin-film pin-grid arrays; Ceramics; Conducting materials; Electrodes; Electronics packaging; Glass; Metallization; Resistors; Sputtering; Substrates; Thin film circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location
Los Angeles, CA
Type
conf
DOI
10.1109/ECC.1988.12616
Filename
12616
Link To Document