• DocumentCode
    2517026
  • Title

    An advanced BiCMOS process utilizing ultra-thin silicon epitaxy over arsenic buried layers

  • Author

    El-Diwany, M. ; Borland, J. ; Chen, J. ; Hu, S. ; van Wijnen, P. ; Vorst, C. ; Akylas, V. ; Brassington, M. ; Razouk, R.

  • Author_Institution
    Philips Res. Lab., Sunnyvale, CA, USA
  • fYear
    1989
  • fDate
    3-6 Dec. 1989
  • Firstpage
    245
  • Lastpage
    248
  • Abstract
    A description is given of SABRe (Submicron Advanced BiCMOS Research), a 0.8- mu m CMOS-based BiCMOS process that utilizes ultrathin (0.8- mu m) undoped epitaxial layers grown on n/sup +/ (arsenic) and p/sup +/ (boron) buried layers. The use of this undoped epitaxial layers enables the independent tailoring of the substrate doping profiles in the MOS and bipolar regions through surface implants alone. Surface channel NMOS and PMOS transistors using n/sup +/ and p/sup +/ doped polysilicon gates with 0.5 mu m effective channel length were achieved along with npn transistors with 11.5-GHz cutoff frequency. The process also features self-aligned cobalt silicide for the gate/emitter and source-drain.<>
  • Keywords
    BIMOS integrated circuits; cobalt compounds; doping profiles; integrated circuit technology; ion implantation; semiconductor technology; 0.5 micron; 0.8 micron; 11.5 GHz; BiCMOS process; SABRe; Si:As buried layers; Si:B buried layers; Submicron Advanced BiCMOS Research; independent tailoring; npn transistors; polysilicon gates; salicides; scaling; self aligned CoSi/sub 2/; silicides; submicron; substrate doping profiles; surface implants alone; ultra thin epitaxial layers; BiCMOS integrated circuits; Boron; Doping profiles; Epitaxial growth; Epitaxial layers; Implants; MOS devices; MOSFETs; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1989. IEDM '89. Technical Digest., International
  • Conference_Location
    Washington, DC, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-0817-4
  • Type

    conf

  • DOI
    10.1109/IEDM.1989.74271
  • Filename
    74271