Analysis of copper alloy to stainless steel bonded panels for ITER first wall applications

The mechanical performance of bi-layer copper alloy (Glidcop CuA115) to 316L stainless steel panels was examined. This work was to analyze potential bonding methodologies for the fabrication of ITER first wall structures, to verify the bond integrity of the fabricated panels, and to establish some mechanical performance parameters for panel structural performance. Two bonding routes were examined: explosively bonding and hot isostatically pressed (HIP) bonding. Following fabrication, the panels were mechanically loaded in tensile and fatigue tests. The mechanical performance test verified that the bond integrity was excellent, and that the primary mode of failure of the bonded panels was related to failure in the base materials rather than lack of adequate bond strength