DocumentCode
2517297
Title
Modeling and characterization of interconnects and IC packages by FDTD 3D simulation
Author
Falconer, M. ; Tripathi, V.
Author_Institution
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
Volume
3
fYear
1997
fDate
8-13 June 1997
Firstpage
1733
Abstract
Time domain electromagnetic simulation of 3-D lossy interconnect coupling and ground bounce in a typical IC package is presented. The FDTD simulation tool is also proposed and used as a Virtual TDR (V-TDR) to extract the circuit models associated with complex 3D structures.
Keywords
circuit analysis computing; digital simulation; finite difference time-domain analysis; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; microwave integrated circuits; 3D lossy interconnect coupling; FDTD 3D simulation; FDTD simulation tool; IC packages; circuit models; complex 3D structures; ground bounce; interconnects; time domain electromagnetic simulation; time domain reflection/transmission; virtual TDR; Circuit simulation; Computational modeling; Crosstalk; Current density; Finite difference methods; Integrated circuit interconnections; Integrated circuit modeling; Integrated circuit packaging; Time domain analysis; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location
Denver, CO, USA
ISSN
0149-645X
Print_ISBN
0-7803-3814-6
Type
conf
DOI
10.1109/MWSYM.1997.596852
Filename
596852
Link To Document