DocumentCode
2517407
Title
Signal Power Integrity and Design Consideration in Package Modeling
Author
Zhao, Jin ; Chan, Edward K.
Author_Institution
Intel Corp., Santa Clara, CA
fYear
2008
fDate
9-12 Dec. 2008
Firstpage
71
Lastpage
77
Abstract
Package electrical modeling is very critical for evaluating system level performance in high speed system design. The properties of the model, for example, the valid frequency range, the accuracy of the model and the complexity of the model, directly affect the simulation results and simulation time. The model should capture enough package electrical behavior to enable accurate signal and power integrity analysis and guide design improvements. This paper presents a thorough review of the challenges in package modeling related with both signal and power integrity. Feasible solutions are presented with practical package modeling examples.
Keywords
electronics packaging; power electronics; reviews; package electrical modeling; package modeling; power integrity; review; signal integrity analysis; Circuit simulation; Couplings; Crosstalk; Frequency; Packaging; Power system modeling; Power transmission lines; Propagation losses; Signal design; System analysis and design;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location
Singapore
Print_ISBN
978-1-4244-2117-6
Electronic_ISBN
978-1-4244-2118-3
Type
conf
DOI
10.1109/EPTC.2008.4763414
Filename
4763414
Link To Document