DocumentCode :
2517407
Title :
Signal Power Integrity and Design Consideration in Package Modeling
Author :
Zhao, Jin ; Chan, Edward K.
Author_Institution :
Intel Corp., Santa Clara, CA
fYear :
2008
fDate :
9-12 Dec. 2008
Firstpage :
71
Lastpage :
77
Abstract :
Package electrical modeling is very critical for evaluating system level performance in high speed system design. The properties of the model, for example, the valid frequency range, the accuracy of the model and the complexity of the model, directly affect the simulation results and simulation time. The model should capture enough package electrical behavior to enable accurate signal and power integrity analysis and guide design improvements. This paper presents a thorough review of the challenges in package modeling related with both signal and power integrity. Feasible solutions are presented with practical package modeling examples.
Keywords :
electronics packaging; power electronics; reviews; package electrical modeling; package modeling; power integrity; review; signal integrity analysis; Circuit simulation; Couplings; Crosstalk; Frequency; Packaging; Power system modeling; Power transmission lines; Propagation losses; Signal design; System analysis and design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
Type :
conf
DOI :
10.1109/EPTC.2008.4763414
Filename :
4763414
Link To Document :
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