• DocumentCode
    2517407
  • Title

    Signal Power Integrity and Design Consideration in Package Modeling

  • Author

    Zhao, Jin ; Chan, Edward K.

  • Author_Institution
    Intel Corp., Santa Clara, CA
  • fYear
    2008
  • fDate
    9-12 Dec. 2008
  • Firstpage
    71
  • Lastpage
    77
  • Abstract
    Package electrical modeling is very critical for evaluating system level performance in high speed system design. The properties of the model, for example, the valid frequency range, the accuracy of the model and the complexity of the model, directly affect the simulation results and simulation time. The model should capture enough package electrical behavior to enable accurate signal and power integrity analysis and guide design improvements. This paper presents a thorough review of the challenges in package modeling related with both signal and power integrity. Feasible solutions are presented with practical package modeling examples.
  • Keywords
    electronics packaging; power electronics; reviews; package electrical modeling; package modeling; power integrity; review; signal integrity analysis; Circuit simulation; Couplings; Crosstalk; Frequency; Packaging; Power system modeling; Power transmission lines; Propagation losses; Signal design; System analysis and design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2117-6
  • Electronic_ISBN
    978-1-4244-2118-3
  • Type

    conf

  • DOI
    10.1109/EPTC.2008.4763414
  • Filename
    4763414