First-principles Investigation of the Structural and Electronic Properties of Cu Based Intermetallics

Author

Chatterjee, Abhijit

Author_Institution

Accelrys Mater. Sci., Tokyo

fYear

2008

fDate

9-12 Dec. 2008

Firstpage

132

Lastpage

136

Abstract

Cu₆Sn₅ is an important intermetallic compound (IMC), which was known to improve greatly the reliability of the solder joints in integrated circuits. The first-principles calculation were performed to determine the stable structure of Cu_(6-x) Ni_xSn₅ IMC. The structural and electronic properties of Cu_(6-x)Ni_xSn₅ IMCs have been calculated. The results of energy calculation and density of states demonstrate that this Cu₄Ni₂Sn₅ IMC had a more stable structure than Cu₆Sn₅. The mechanical stability of the systems was studied to compare the compressibility of the matrices. A priori rule is formulated to correlate the stability and composition of the said intermetallics.

Keywords

ab initio calculations; copper alloys; crystal structure; electronic density of states; integrated circuit packaging; integrated circuit reliability; mechanical stability; nickel alloys; tin alloys; Cu_6-xNi_xSn; density of states; electronic properties; first-principles calculations; intermetallic compound; mechanical stability; structural properties; Bonding; Electronics industry; Intermetallic; Materials science and technology; Microstructure; Monitoring; Soldering; Solid state circuits; Stability; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th

Conference_Location

Singapore

Print_ISBN

978-1-4244-2117-6

Electronic_ISBN

978-1-4244-2118-3

Type

conf

DOI

10.1109/EPTC.2008.4763423

Filename

4763423