• DocumentCode
    2517797
  • Title

    Mesh Interconnects for Silicone Embedded Stretchable Silicon Electronics

  • Author

    Sosin, S. ; Zoumpoulidis, T. ; Bartek, M. ; Wang, L. ; Jansen, K.M.B. ; Ernst, L.J.

  • Author_Institution
    Delft Inst. of Microsyst. & Nanoelectron., Delft Univ. of Technol., Delft, Netherlands
  • fYear
    2008
  • fDate
    9-12 Dec. 2008
  • Firstpage
    230
  • Lastpage
    235
  • Abstract
    A process development for stretchable silicon electronics encapsulated in a layer of polydimethylsiloxane is presented. Stretchability is achieved by segmenting the normally rigid silicon substrate into small islands (<2×2 mm2) and connecting these by flexible metal interconnects. The metal interconnects have a mesh shape providing stretchability and improved reliability. The mesh-shaped interconnects have been simulated and measured as free standing before being integrated in the final stretchable system design. PDMS (polydimethylsiloxane) encapsulation using either Elastosil or Sylgard, having good chemical and mechanical resistance, provides protection of the final system but it also helps during fabrication. The fabricated samples (ID array silicon islands with mesh interconnects embedded in Elastosil) have been mechanically and electrically tested and provide reversible stretchability to around 100%.
  • Keywords
    conducting polymers; flexible electronics; integrated circuit interconnections; silicon; silicon compounds; 1D array silicon islands; Elastosil; Si; SiO2; Sylgard; chemical resistance; flexible metal interconnects; mechanical resistance; mesh interconnects; mesh-shaped interconnects; metal interconnects; polydimethylsiloxane; silicon substrate; silicone embedded stretchable silicon electronics; stretchability; stretchable system design; Chemicals; Electric resistance; Electrical resistance measurement; Encapsulation; Fabrication; Joining processes; Protection; Shape; Silicon; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2117-6
  • Electronic_ISBN
    978-1-4244-2118-3
  • Type

    conf

  • DOI
    10.1109/EPTC.2008.4763439
  • Filename
    4763439