Title :
Parametric Analysis of Embedded EBG Structures for Noise Suppression Applications
Author :
Ng, Y.T. ; Wai, L.L. ; Fan, W. ; Gian, P.W. ; Lu, H. ; Lu, A.C.W.
Author_Institution :
Singapore Inst. of Manuf. Technol., Singapore
Abstract :
This paper discloses the design optimization of embedded electromagnetic bandgap (EBG) structures for noise suppression in power/ground plane applications. We have established the design rules for EBG using finite-element based parametric analysis and extraction of the equivalent circuit models for EBG. The concept can be applied to achieve desired operating frequencies and dimensions, by tuning values of EBG elements. This study mainly focused on design of a miniaturized EBG, with frequency range of 2 GHz to 10 GHz and overall substrate dimension of 20 mm times 20 mm. Several parameters have been studied in EBG design including via diameter, via length, patch dimension and dielectric constant of material. Equivalent circuit analysis is used to analyze design parameters. By leveraging on liquid crystal polymer (LCP) with a dielectric constant of 2.9, an ultra-thin EBG implementation is achieved. With our approach, the volumetric efficiency, defined as the -30 dB bandwidth per substrate volume, ranges from 0.046 to 0.181 GHz per mm3, more than 10 times better than conventional topologies.
Keywords :
equivalent circuits; finite element analysis; liquid crystal polymers; optimisation; permittivity; photonic band gap; design optimization; dielectric constant; embedded electromagnetic bandgap structures; equivalent circuit models; finite-element analysis; liquid crystal polymer; parametric analysis; Circuit noise; Design optimization; Dielectric constant; Dielectric substrates; Electromagnetic interference; Equivalent circuits; Finite element methods; Frequency; Metamaterials; Periodic structures; Electromagnetic bandgap; Finite-element; circuit modeling; liquid crystal polymer; noise supression;
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
DOI :
10.1109/EPTC.2008.4763445