DocumentCode :
2518187
Title :
Stacked Thermoelectric Generator Module Integrated with Partial Electric Conducted Interposer Structure
Author :
Hsu, Chung-Yen ; Liu, Chun-Kai ; Chien, Heng-Chieh ; Kuo, Sheng-Liang ; Yu, Chih-Kuang
Author_Institution :
Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Taiwan
fYear :
2008
fDate :
9-12 Dec. 2008
Firstpage :
355
Lastpage :
360
Abstract :
In this paper, we designed a new type of stacked thermoelectric generator (TEG) module integrated with partial electric conducted interposer (PECI) structure. The partial electric conducted interposer is assembled among the thermoelectric generator with 36 pairs of thermoelectric piles. The thermoelectric piles are made of P-type and N-type Bi2Te3 material with the thickness of 2 mm and the cross section area of 4 mm x 4 mm. The interposer is composed of low thermal conductivity material and partial distributed metal via, which leads to the characteristics of electrical conducted and highly thermal resisted. Results showed that under same heating power imported to the hot side of thermoelectric generator and same temperature controlled at the cold side, the temperature difference between these two sides performed a higher value of 13.6% in the interposing cases than that in conventional cases, and resulted in a higher output power of 10.6%.
Keywords :
bismuth compounds; modules; thermoelectric conversion; thermopiles; Bi2Te3; N-type material; P-type material; partial distributed metal via; partial electric conducted interposer structure; size 2 mm; stacked thermoelectric generator module; thermal conductivity; thermoelectric piles; Assembly; Bismuth; Conducting materials; Inorganic materials; Lead; Power generation; Tellurium; Thermal conductivity; Thermal resistance; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
Type :
conf
DOI :
10.1109/EPTC.2008.4763460
Filename :
4763460
Link To Document :
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