DocumentCode :
2518206
Title :
Process Technology of High-Aspect-Ratio Silicon Beams for Stretchable Silicon Electronics
Author :
Zoumpoulidis, T. ; Tian, J. ; Sosin, S. ; Bartek, M. ; Wang, L. ; Jansen, K.M.B. ; Ernst, L.J. ; de Graaf, P. ; Dekker, R.
Author_Institution :
Delft Univ. of Technol., Delft
fYear :
2008
fDate :
9-12 Dec. 2008
Firstpage :
361
Lastpage :
366
Abstract :
The feasibility of transforming completed CMOS/MEMS circuitry and designs from their rigid form realized in a silicon chip into a stretchable system is investigated by fabricating matrix arrays of silicon segments mechanically interconnected with deformable beams. High aspect ratio silicon beams are used both as molds and scaffolds for fabricating structures of Parylene and silicon-Parylene beams between the rigid silicon segments. The fabricated arrays are easily deformed with no particular precautions demonstrating the robustness of the designs. A low thermal budget (<400degC) of the proposed fabrication sequence provides compatibility with CMOS processing and it can therefore be applied as a post processing module.
Keywords :
CMOS integrated circuits; elemental semiconductors; micromechanical devices; silicon; CMOS/MEMS circuitry; Parylene; Si; deformable beams; high-aspect-ratio silicon beams; matrix arrays; silicon segments; silicon-Parylene beams; stretchable silicon electronics; Actuators; Aluminum; CMOS process; Conductors; Integrated circuit interconnections; Mechanical factors; Micromechanical devices; Polyimides; Silicon; Stress; Parylene; Stretchable electronics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
Type :
conf
DOI :
10.1109/EPTC.2008.4763461
Filename :
4763461
Link To Document :
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