3D Integration-Present and Future

Demand for high speed, high density, small size, and multifunctional electronic devices has driven the development of 3D integration. Both die-to-die-stack and package-on-package 3D integration are in mass production. However, through silicon via (TSV) 3D integration is the future direction. Materials and processes for TSV 3D interconnection are reviewed in this paper. Those include processes for via drilling process, via liner (insulating) material, and via filling material. The materials for thin wafer support, mechanical, and electrical interconnection for TSV devices are also discussed.