Title :
In-Situ Optical Creep Observation and Constitutive Modelling of Joint-Scale SAC Solder Shear Samples
Author :
Herkommer, Dominik ; Reid, Michael ; Punch, Jeff
Author_Institution :
Stokes Inst., Univ. of Limerick, Limerick, Ireland
Abstract :
In this paper the creep behaviour of lead-free hypo-eutectic Sn96.5Ag3.0Cu0.5 solder is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs have been conducted. The tests were observed in-situ with a high magnification camera system. The quantitative data gained from the tests was used to fit an Anand viscoplastic model. Optical observation results are presented from selected tests, showing the occurrence of surface effects such as shear bands, voiding and rumpling. From these observations the main deformation mechanisms were derived and compiled in terms of their dependence of the test conditions.
Keywords :
copper alloys; creep; shear deformation; silver alloys; solders; stress-strain relations; tin alloys; viscoplasticity; Anand viscoplastic model; SnAgCu; hypo-eutectic solder; joint-scale solder; optical creep; rumpling; shear bands; strain; surface effects; voiding; Assembly; Capacitive sensors; Creep; Electronic equipment testing; Environmentally friendly manufacturing techniques; Lead; Life testing; Materials testing; Stress; Temperature;
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
DOI :
10.1109/EPTC.2008.4763484
