• DocumentCode
    2518660
  • Title

    Degradation of electromechanical switches submitted to mechanical vibration: Bounce time detection through an automatic measurement system

  • Author

    Biagi, E. ; Zanini, A.

  • Author_Institution
    Dept. of Electron. Eng., Firenze Univ., Italy
  • fYear
    1993
  • fDate
    18-20 May 1993
  • Firstpage
    534
  • Lastpage
    536
  • Abstract
    The kinetic behavior of the switching contacts of electromechanical components with removable parts can be a cause of transient phenomena which affect the function of electronic circuits where they are employed. It is to be expected that these transients will grow if switching contacts are subjected to mechanical stresses. The authors characterize the degradation phenomena which occur when the switches are stressed in a cyclic manner. Bounce time and contact resistance measurements were carried out as the number of stress cycles increased. The growth of closing bounce time with cumulative vibration cycles was experimentally observed and the most significative parameters of this relation were selected. This characteristic can be considered as a suitable indicator of the degradation phenomena which occurs in electromechanical switches subjected to mechanical stress
  • Keywords
    automatic test equipment; characteristics measurement; electronic equipment testing; mechanical testing; stress effects; switches; transients; vibrations; automatic measurement system; closing bounce time; contact resistance measurements; cumulative vibration cycles; cyclic stressing; electromechanical switches; kinetic behavior; mechanical stresses; mechanical vibration; switching contacts; time detection; transient phenomena; Contact resistance; Degradation; Electrical resistance measurement; Electronic circuits; Kinetic theory; Stress measurement; Switches; Switching circuits; Time measurement; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference, 1993. IMTC/93. Conference Record., IEEE
  • Conference_Location
    Irvine, CA
  • Print_ISBN
    0-7803-1229-5
  • Type

    conf

  • DOI
    10.1109/IMTC.1993.382586
  • Filename
    382586