A solder joint inspection system for automated printed circuit board manufacturing

Author

Park, Jong-Seok ; Tou, Julius T.

Author_Institution

Center for Inf. Res., Florida Univ., Gainesville, FL, USA

fYear

1990

fDate

13-18 May 1990

Firstpage

1290

Abstract

The design of a solder joint inspection system which will be used as an integral part of the PCB/AID (automated inspection and diagnosis for PC board manufacturing) system is presented. The inspection system utilizes four frames of solder joint images, extracts 15 features from the images to categorize the most important seven classes of solder joint defects, and provides two forms of inspection results according to their applications (touch-up of defects and fault diagnosis for online process control). The system has been tested for several PC boards provided by electronics firms, and experimental results have shown that it has exceptional promise

Keywords

assembling; automatic optical inspection; computer vision; factory automation; inspection; printed circuit manufacture; PCB manufacture; PCB/AID; defect diagnosis; factory automation; online process control; solder joint inspection system; Electronic equipment testing; Electronics industry; Feature extraction; Inspection; Manufacturing automation; Printed circuits; Process control; Soldering; System testing; X-ray lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Robotics and Automation, 1990. Proceedings., 1990 IEEE International Conference on

Conference_Location

Cincinnati, OH

Print_ISBN

0-8186-9061-5

Type

conf

DOI

10.1109/ROBOT.1990.126177

Filename

126177