Title :
Creep Properties of Sn3wt%Ag0.5wt%Cu0.019wt%Ce (SACC) Lead-Free Solder
Author :
Tan, Kok Ee ; Luhua, Xu ; Pang, John H.L. ; Lau, John H. ; Zhang, X.W.
Author_Institution :
Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
Abstract :
Lead free solders with Sn-Ag-Cu (SAC) alloy compositions are now widely used in the electronics industry. Further enhancement of SAC solders by small addition of a forth element is aimed to improve the solder mechanical properties and the solder joint properties at the intermetallic bond interfaces. The addition of Ce to SAC solder with an alloy composition of Sn.3wt%Ag0.5wt%Cu0.019wt%Ce (SACC) shows improvement in mechanical properties. In this study, the steady state creep properties of bulk SACC lead free solder were characterized and curve fitted to constitutive models for steady-state creep behavior.
Keywords :
cerium alloys; copper alloys; creep; silver alloys; solders; tin alloys; Sn-Ag-Cu-Ce; electronics industry; intermetallic bond interfaces; lead-free solder; mechanical properties; solder joint properties; steady-state creep; Capacitive sensors; Creep; Environmentally friendly manufacturing techniques; Lead; Materials testing; Mechanical factors; Soldering; Steady-state; Stress; Temperature; coefficient of thermal expansion; hyperbolic-sine model; lead free solder; power-law model; steady state creep;
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
DOI :
10.1109/EPTC.2008.4763486
