DocumentCode
2518857
Title
Is it Really Impossible? Combining Superior Anti-Oxidation and Superior Print
Author
Lee, Ning-Cheng
Author_Institution
Indium Corp., Clinton, NY, USA
fYear
2008
fDate
9-12 Dec. 2008
Firstpage
571
Lastpage
574
Abstract
Miniaturization results in excessive oxidation for reflow soldering applications. Approaches for enhancing the oxidation barrier restricts the potential for improvement due to the difficulty of concurrent solder paste deposition. A new lead-free no-clean paste Indium 8.9ATG has been developed, which provides both superior anti-oxidation and printing performance. The flux technology developed also brings in other improvement such as low voiding.
Keywords
oxidation; printing; soldering; anti-oxidation; flux technology; low voiding; oxidation barrier; paste indium 8.9ATG; printing; reflow soldering; solder paste deposition; Atmosphere; Costs; Environmentally friendly manufacturing techniques; Heating; Indium; Lead; Oxidation; Printing; Reflow soldering; Surface-mount technology; SIR; SMT; flux; graping; oxidation; print; reflow; solder; solder paste; soldering; voiding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location
Singapore
Print_ISBN
978-1-4244-2117-6
Electronic_ISBN
978-1-4244-2118-3
Type
conf
DOI
10.1109/EPTC.2008.4763494
Filename
4763494
Link To Document