Inspection of Miniaturised Interconnections in IC Packages with Nanofocus Â® X-Ray Tubes and NanoCT

Author

Roth, H. ; He, Z. ; Paul, T.

Author_Institution

PhoenixlX-ray Syst. + Services GmbH, Wunstorf, Germany

fYear

2008

fDate

9-12 Dec. 2008

Firstpage

644

Lastpage

649

Abstract

Nanofocus^Â® tube technology and high resolution CT are the future inspection tools for IC packages. The elementary principles and techniques of latest 2D and 3D nanofocus^Â® techniques are briefly outlined and typical results of highest resolution failure analysis including bond wire defects, copper bond wire inspection, Flip Chip solder interconnection and microvia inspection are presented.

Keywords

X-ray tubes; computerised tomography; failure analysis; flip-chip devices; inspection; integrated circuit interconnections; integrated circuit packaging; lead bonding; monolithic integrated circuits; nanotechnology; solders; IC packages; bond wire defects; copper bond wire inspection; digital nanofocus X-ray inspection system; failure analysis; flip chip solder interconnection; inspection tools; microvia inspection; miniaturised interconnections; nanoCT; nanofocus X-ray tubes; Bonding; Computed tomography; Copper; Failure analysis; Flip chip; Image resolution; Inspection; Integrated circuit packaging; Wire; X-ray imaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th

Conference_Location

Singapore

Print_ISBN

978-1-4244-2117-6

Electronic_ISBN

978-1-4244-2118-3

Type

conf

DOI

10.1109/EPTC.2008.4763506

Filename

4763506