DocumentCode :
2519090
Title :
A simple low-cost, thermistor-based, local air-velocity mapping method (PCB modules)
Author :
Alba, John ; Bolton, Steve
Author_Institution :
GenRad Inc., Concord, MA, USA
fYear :
1988
fDate :
9-11 May 1988
Firstpage :
385
Lastpage :
389
Abstract :
A method is presented for using interchangeable thermistors as local air-velocity transducers for the thermal verification of electronic assemblies. Because of their small size, thermistors are ideally suited for local velocity measurements in hard-to-reach places, and do not interfere with the phenomena being measured. Accuracy is acceptable in the velocity range from 0 to 600 ft/min, in the ambient temperature range from 20 to 45 degrees C, and the cost is lower than that of other sensors. Because the thermistor is intrinsically a temperature sensor, it can also double as a local air-temperature transducer. Thermistor signals are high level, and therefore easier to read than those from other types of transducers such as thermocouples or transistor junctions, and no reference temperatures or precalibration are required. Used in conjunction with data logging equipment and a computer, a printed-circuit module is produced, displayed, and stored. These data are intended for use with proprietary software to predict individual board component junction temperatures and failure rate.<>
Keywords :
computerised instrumentation; packaging; printed circuit testing; thermistors; transducers; velocity measurement; 20 to 45 C; board component junction temperatures; computer; data logging equipment; electronic assemblies; failure rate; local air-velocity mapping method; local air-velocity transducers; printed-circuit module; proprietary software; real-time air velocity mapping; temperature sensor; thermal verification; thermistor signal; velocity measurements; Assembly; Computer displays; Costs; Sensor phenomena and characterization; Size measurement; Temperature distribution; Temperature sensors; Thermistors; Transducers; Velocity measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA, USA
Type :
conf
DOI :
10.1109/ECC.1988.12621
Filename :
12621
Link To Document :
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