Title :
Embedded multiconductor transmission line characterization
Author_Institution :
Nat. Inst. of Stand. & Technol., Boulder, CO, USA
Abstract :
This paper presents a measurement method that characterizes lossy printed multiconductor transmission lines embedded in transitions, connectors, or packages with significant electrical parasitics. We test the method on a pair of lossy coupled asymmetric microstrip lines and compare to previous results.
Keywords :
microstrip lines; connector; coupled asymmetric microstrip lines; electrical parasitics; embedded lossy printed multiconductor transmission line; measurement method; package; transition; Connectors; Couplings; Electric variables measurement; Loss measurement; Microstrip; Multiconductor transmission lines; Packaging; Propagation losses; Testing; Transmission line measurements;
Conference_Titel :
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-3814-6
DOI :
10.1109/MWSYM.1997.596863
