• DocumentCode
    2519276
  • Title

    Ionic Winds for Enhanced Cooling in Portable Platforms

  • Author

    Go, David B. ; Maturana, Raul A. ; Mongia, Rajiv K. ; Garimella, Suresh V. ; Fisher, Timothy S.

  • Author_Institution
    Sch. of Mech. Eng. & Birck Nanotechnol. Center, Purdue Univ., Lafayette, IN, USA
  • fYear
    2008
  • fDate
    9-12 Dec. 2008
  • Firstpage
    737
  • Lastpage
    742
  • Abstract
    While cooling of the microchip continues to receive significant interest in most electronic devices, portable platforms such as notebooks, multi-use cellular phones, and ultra-mobile personal computers (PCs) present unique thermal management challenges as well. Cooling non-processor components such as wireless devices and the skin of the device are becoming the important thermal management drivers, and volume and power constraints are limiting the practicality of including larger or additional conventional fans. Ionic wind engines are devices which generate air flow with no moving parts, and feature low power consumption and a small volumetric footprint. An ionic wind is produced when positive air ions are accelerated in a particular direction by an electric field, and exchange momentum with neutral air molecules, thus generating a body force on the air. In the presence of an existing bulk flow, an ionic wind distorts the boundary layer and increases the local cooling effect at a heated wall. A free-standing ionic wind engine with an electrode gap of approximately 1 mm has been constructed. Experiments show that the ionic wind engine can enhance the local heat transfer coefficient of a low-speed flow by as much as 50%. The impact of the ionic wind is shown to increase with current and decrease as the bulk flow increases.
  • Keywords
    cooling; heat engines; portable instruments; air flow; cooling; electric field; exchange momentum; heat transfer; ionic winds; portable platforms; positive air ions; Cellular phones; Electronics cooling; Energy management; Engines; Microcomputers; Personal communication networks; Skin; Thermal management; Thermal management of electronics; Wind energy generation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2117-6
  • Electronic_ISBN
    978-1-4244-2118-3
  • Type

    conf

  • DOI
    10.1109/EPTC.2008.4763520
  • Filename
    4763520