• DocumentCode
    2519293
  • Title

    Experimental Study on the Use of PCM-based Heat Sink for Cooling of Mobile Devices

  • Author

    Wong, H.E. ; Tan, F.L. ; Fok, S.C.

  • Author_Institution
    Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2008
  • fDate
    9-12 Dec. 2008
  • Firstpage
    743
  • Lastpage
    748
  • Abstract
    An experimental study is conducted on the cooling of portable electronic devices using PCM-based heat sinks. The design uses different aluminum heat sinks filled with n-eicosane to store and dissipate the generated heat. The temperature profiles at three different power levels, (i.e. 3 W, 4 W and 5 W) for three different positions (i.e. horizontally, vertically and inclined at 45° to the horizontal) are measured. In addition, the surface temperature of each setup is captured with a thermal imager. The experimental results indicate that the PCM-based heat sinks can be used to effectively manage the temperature of portable electronic devices. Based on this finding, mathematical models are currently being developed to facilitate the optimal designs of PCM-based heat sinks.
  • Keywords
    cooling; heat sinks; phase change materials; PCM-based heat sink; aluminum heat sinks; cooling; mobile devices; n-eicosane; portable electronic devices; power 3 W; power 4 W; power 5 W; power levels; surface temperature; temperature profiles; thermal imager; Electronic components; Electronic packaging thermal management; Electronics cooling; Heat sinks; Mobile handsets; Personal digital assistants; Phase change materials; Temperature; Thermal management; Thermal management of electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2117-6
  • Electronic_ISBN
    978-1-4244-2118-3
  • Type

    conf

  • DOI
    10.1109/EPTC.2008.4763521
  • Filename
    4763521