DocumentCode
2519293
Title
Experimental Study on the Use of PCM-based Heat Sink for Cooling of Mobile Devices
Author
Wong, H.E. ; Tan, F.L. ; Fok, S.C.
Author_Institution
Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
fYear
2008
fDate
9-12 Dec. 2008
Firstpage
743
Lastpage
748
Abstract
An experimental study is conducted on the cooling of portable electronic devices using PCM-based heat sinks. The design uses different aluminum heat sinks filled with n-eicosane to store and dissipate the generated heat. The temperature profiles at three different power levels, (i.e. 3 W, 4 W and 5 W) for three different positions (i.e. horizontally, vertically and inclined at 45° to the horizontal) are measured. In addition, the surface temperature of each setup is captured with a thermal imager. The experimental results indicate that the PCM-based heat sinks can be used to effectively manage the temperature of portable electronic devices. Based on this finding, mathematical models are currently being developed to facilitate the optimal designs of PCM-based heat sinks.
Keywords
cooling; heat sinks; phase change materials; PCM-based heat sink; aluminum heat sinks; cooling; mobile devices; n-eicosane; portable electronic devices; power 3 W; power 4 W; power 5 W; power levels; surface temperature; temperature profiles; thermal imager; Electronic components; Electronic packaging thermal management; Electronics cooling; Heat sinks; Mobile handsets; Personal digital assistants; Phase change materials; Temperature; Thermal management; Thermal management of electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location
Singapore
Print_ISBN
978-1-4244-2117-6
Electronic_ISBN
978-1-4244-2118-3
Type
conf
DOI
10.1109/EPTC.2008.4763521
Filename
4763521
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