DocumentCode
2519324
Title
A multi-chip directly mounted 512 MEMS mirror array module with hermetically sealed package for large optical cross-connects
Author
Mi, Junping ; Soneda, Hiromitsu ; Okuda, Haruhisa ; Tsuboi, O. ; Kouma, N. ; Mizuno, Yosuke ; Ueda, Shuichi ; Sawaki, I.
Author_Institution
Fujitsu Ltd., Akashi
fYear
2005
fDate
1-4 Aug. 2005
Firstpage
195
Lastpage
196
Abstract
A 512 MEMS mirror array module with a hermetically sealed package for large optical cross-connects is constructed by using newly developed multi-chip direct mounting (MCDM) technology and is demonstrated to enable a plusmn5 degree rotation of the two-axis stationary operation under a drive voltage of 160 V, while having a high resonance frequency of 2 kHz
Keywords
micromechanical devices; micromirrors; optical arrays; optical fibre communication; optical interconnections; 160 V; 2 kHz; MEMS mirror array module; hermetically sealed package; multichip direct mounting technology; optical cross-connect; resonance frequency; Actuators; Gold; Hermetic seals; Micromechanical devices; Mirrors; Optical arrays; Optical crosstalk; Packaging; Resonance; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical MEMS and Their Applications Conference, 2005. IEEE/LEOS International Conference on
Conference_Location
Oulu
Print_ISBN
0-7803-9278-7
Type
conf
DOI
10.1109/OMEMS.2005.1540146
Filename
1540146
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