Reliability overview of RF MEMS devices and circuits

Author

Melle, S. ; Flourens, F. ; Dubuc, D. ; Grenier, K. ; Pons, P. ; Pressecq, F. ; Kuchenbecker, J. ; Muraro, J.L. ; Bary, L. ; Plana, R.

Author_Institution

Lab. d´´Autom. et d´´Anal. des Syst., CNRS, Toulouse, France

Volume

1

fYear

2003

fDate

7-9 Oct. 2003

Firstpage

37

Abstract

This paper outlines the reliability properties of RF MEMS devices and circuits. The tools used to evaluate the reliability properties are presented. Results am shown on both moveable and non moveable devices. Key parameters that drive the reliability are pointed out: stress, roughness, temperature dependance, dielectric properties Finally, it is presented some solutions to improve the reliability performance of these devices in term of technology and design.

Keywords

contact resistance; internal stresses; life testing; micromechanical devices; microswitches; microwave circuits; microwave filters; microwave switches; millimetre wave devices; semiconductor device reliability; surface roughness; IC process compatibility; MEMS technology; RF MEMS circuits; RF MEMS devices; contact resistance; dielectric properties; dynamic behavior; life test; low insertion loss filter; microswitch; moveable devices; nonmoveable devices; reliability performance; roughness; stress; temperature dependance; Circuits; Filters; Insertion loss; Micromechanical devices; Packaging; Radiofrequency microelectromechanical systems; Space technology; Stress; Switches; Topology;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2003. 33rd European

Print_ISBN

1-58053-834-7

Type

conf

DOI

10.1109/EUMC.2003.1262212

Filename

1262212