Holographic pattern measuring system and its application to deformation analysis of printed circuit board due to heat of mounted parts

Author

Tanguch, M. ; Takagi, Tasuku

Author_Institution

Fac. of Sci. & Technol., Meijo Univ., Nagoya, Japan

fYear

1993

fDate

18-20 May 1993

Firstpage

304

Lastpage

308

Abstract

A new measuring system, the holographic pattern measuring system (HPMS) was developed which is composed of both the techniques of holography and graphic image processing. It was applied to deformation analysis of printed circuit boards (PCB) due to heat generated by mounted parts. The HPMS was applied to obtain the 3-dimensional graphic image pattern of the deformation of the PCB due to thermal stress with an accuracy of 0.1 μm. A comparison was made of the image pattern obtained by the HPMS and the thermographic pattern of the PCB surface. The HPMS pattern was different from the thermographic pattern. The results showed that the thermal deformation of the PCB could not be estimated from the thermographic pattern

Keywords

deformation; holographic interferometry; image processing; infrared imaging; printed circuit testing; stress analysis; thermal stresses; 3-dimensional graphic image pattern; PCB; calibration; deformation analysis; graphic image processing; holography; mounted parts; printed circuit board; thermal deformation; thermal stress; thermographic pattern; Circuit analysis; Computer graphics; Holography; Image processing; Laser beams; Optical interferometry; Pattern analysis; Printed circuits; Spline; Wavelength measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Instrumentation and Measurement Technology Conference, 1993. IMTC/93. Conference Record., IEEE

Conference_Location

Irvine, CA

Print_ISBN

0-7803-1229-5

Type

conf

DOI

10.1109/IMTC.1993.382630

Filename

382630