DocumentCode
2519727
Title
UV-embossing process for replicating micro optical element with continuous relief structure based on thiol-ene polymer
Author
Jin, Peng ; Liu, Nan ; Wang, Guanxiong
Author_Institution
Center of Ultra-precision Optoelectron. Instrum., Harbin Inst. of Technol., Harbin, China
fYear
2010
fDate
3-6 Dec. 2010
Firstpage
1
Lastpage
3
Abstract
UV-embossing process is a potential method for replicating micro optical element with continuous relief structure. Acrylate-based UV-induced polymer was traditional used, and there exists much limitation. In this paper, a novel thiol-ene was used in UV-embossing process as resist. And it can be shown in experiment that micro structure can be precisely replicated, and fabrication error is less than 3%. Meanwhile, the resistance of this material is well. Micro structure of MOE can be transferred into fused silica equally through reactive ion etching process. After etching process, the error is less than 5%. So it can be seen that the process is a proper method for fabrication of micro optical element.
Keywords
embossing; micro-optics; microfabrication; optical polymers; sputter etching; UV embossing; UV-induced polymer; continuous relief structure; microoptical element; microstructure; reactive ion etching; thiolene polymer; Etching; Lithography; Optical device fabrication; Resists; Silicon compounds; Substrates; UV-embossing; micro optical element; reactive ion etching; thiol-ene;
fLanguage
English
Publisher
ieee
Conference_Titel
Advances in Optoelectronics and Micro/Nano-Optics (AOM), 2010 OSA-IEEE-COS
Conference_Location
Guangzhou
Print_ISBN
978-1-4244-8393-8
Electronic_ISBN
978-1-4244-8392-1
Type
conf
DOI
10.1109/AOM.2010.5713593
Filename
5713593
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