• DocumentCode
    2519794
  • Title

    A thick-film ceramic capacitive sensor for embedding in polymer extrusion die

  • Author

    Coffey, David ; Jara-Almonte, James ; Knopf, William H.

  • Author_Institution
    Xerox Corp., Rochester, NY, USA
  • fYear
    1993
  • fDate
    18-20 May 1993
  • Firstpage
    171
  • Lastpage
    176
  • Abstract
    A key component for self-actuating polymer extrusion dies, the in situ gap sensor, was designed. The authors describe the preliminary design and tests of a new thick film ceramic capacitive sensor which is intended to improve in situ gap measurements. The sensor consists of three layers of ceramic tape. The sensor and guard geometries are silk-screened onto two of the layers while in the green state. The third layer is used to protect the geometries from the molten polyester and the cleaning operations. Tests with three different sensor geometries indicate that the sensor output is linearly proportional to gap size for 0 to 3 mm gaps. The gaps of interest are in the 1 to 1.5 mm range. The accuracy and repeatability of the output voltage were within acceptable limits. Sensor performance was not affected by light grinding and polishing. Although the output DC voltage varies nonlinearly with temperature, this is not expected to hinder its use in this application
  • Keywords
    displacement measurement; electric sensing devices; grinding; integrated circuit technology; polishing; polymer films; surface cleaning; thick film capacitors; 0 to 3 mm; 1 to 1.5 mm; accuracy; ceramic tape; cleaning; embedding; guard geometries; in situ gap measurements; light grinding; molten polyester; output DC voltage; polishing; polymer extrusion die; preliminary design; repeatability; tests; thick-film ceramic capacitive sensor; Capacitive sensors; Ceramics; Geometry; Green cleaning; Polymers; Protection; Testing; Thick films; Thickness measurement; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference, 1993. IMTC/93. Conference Record., IEEE
  • Conference_Location
    Irvine, CA
  • Print_ISBN
    0-7803-1229-5
  • Type

    conf

  • DOI
    10.1109/IMTC.1993.382657
  • Filename
    382657