DocumentCode
2520091
Title
Progress on distributed resistance model for pHEMT
Author
Yin, Hong ; Wei, Cejun ; Zhu, Yu ; Klimashov, Alex ; Zhang, Cindy ; Bartle, Dylan
Author_Institution
Skyworks Solutions Inc., Woburn, MA, USA
fYear
2010
fDate
15-17 Dec. 2010
Firstpage
1
Lastpage
4
Abstract
With increasing scale and complexity in pHEMT circuit and dimension shrinking in unit pHEMT devices, distributed effects are becoming more crucial than ever. During design of amplifiers, precise prediction of the resistances of a device is vital to simulation result due to the direct impact on impedance. This work reports a set of experiments utilizing different testing structures to reveal how a pHEMT device´s layout affects its gate-to-source/drain resistances due to distribution of resistance along electrodes and the consequent current crowding. As an example, a distributed resistance model of source-side gate bar is quantitatively analyzed. It is shown that the prediction of the model coincides with the measurement data obtained from a variety of testing devices with different numbers of gate fingers.
Keywords
HEMT circuits; amplifiers; circuit complexity; electric resistance; electrodes; high electron mobility transistors; semiconductor device models; semiconductor device testing; amplifier design; distributed resistance model; electrode; gate-to-drain resistance; gate-to-source resistance; pHEMT circuit complexity; pHEMT device; pHEMT device layout testing; source-side gate bar; Current measurement; Electrical resistance measurement; Electrodes; Fingers; Logic gates; Mathematical model; Resistance; GaAs pHEMT; current crowding; distributed resistance; gate resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Solid-State Circuits (EDSSC), 2010 IEEE International Conference of
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-9997-7
Type
conf
DOI
10.1109/EDSSC.2010.5713675
Filename
5713675
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