DocumentCode :
2520204
Title :
Electrostatic discharge (ESD): A spoiler to development of next-generation technologies?
Author :
Liou, Juin J.
Author_Institution :
Univ. of Central Florida, Orlando, FL, USA
fYear :
2010
fDate :
15-17 Dec. 2010
Firstpage :
1
Lastpage :
3
Abstract :
Electrostatic discharge (ESD) is a process in which a finite amount of charge is transferred from one object (i.e., human body) to the other (i.e., microchip). This process can result in a very high current passing through the object within a very short period of time. To prevent ESD-induced damages to integrated circuits, it is imperative to develop and implement ESD protection structures. An effective way to protect the electronics system against ESD events is to incorporate an ESD protection structure on the microchip (i.e., called the on chip ESD protection) to increase the survivability of the core circuit can survive when an ESD strikes.
Keywords :
electrostatic discharge; integrated circuit design; microprocessor chips; protection; ESD events; ESD protection structures; ESD-induced damages; core circuit; electronics system; electrostatic discharge; integrated circuits; microchip; next-generation technology; on chip ESD protection; CMOS integrated circuits; Electric potential; Electrostatic discharge; GSM; Industries; Robustness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices and Solid-State Circuits (EDSSC), 2010 IEEE International Conference of
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-9997-7
Type :
conf
DOI :
10.1109/EDSSC.2010.5713681
Filename :
5713681
Link To Document :
بازگشت