• DocumentCode
    2520330
  • Title

    Temporal growth of partial discharge generated nanometric mica structures

  • Author

    Paterson, Jason ; Shields, Andrew J. ; Hepburn, Donald M.

  • Author_Institution
    Glasgow Caledonian Univ., Glasgow, UK
  • fYear
    2011
  • fDate
    16-19 Oct. 2011
  • Firstpage
    68
  • Lastpage
    71
  • Abstract
    Mica-polymer insulation systems are integral to high power rotating plant: mica is used in the insulation found in the stator windings of high power rotating plant as it provides high dielectric strength and resistance to partial discharge. Current and forecast future economic factors are forcing owners of high power rotating plant to assess the integrity and remnant life of mica based insulators as well forcing the development of plant life extension strategies. As exposure to partial discharge is thought to provide stress which leads to degradation of mica, contributing to eventual failure, experiments were undertaken to investigate the material effects. This paper compares and analyses mica in the natural condition with mica that has undergone exposure to point plane stressing with 2kV 1mm gap in air. Atomic Force Microscopy (AFM) was used to examine the resulting changes in surface topography.
  • Keywords
    atomic force microscopy; electric machines; mica; partial discharges; polymer insulators; stators; AFM; atomic force microscopy; economic factors; high dielectric strength; high power rotating plant; mica-polymer insulation systems; nanometric mica structures; partial discharge temporal growth; plant life extension; size 1 mm; stator windings; surface topography; voltage 2 kV; Discharges; Electrodes; Fault location; Partial discharges; Surface discharges; Surface topography;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2011 Annual Report Conference on
  • Conference_Location
    Cancun
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4577-0985-2
  • Type

    conf

  • DOI
    10.1109/CEIDP.2011.6232598
  • Filename
    6232598