• DocumentCode
    2520387
  • Title

    A New Algorithm for EM Analysis Considering Multiple Driving Forces Mechanism

  • Author

    Liang, Lihua ; Zhang, Yuanxiang ; Chen, Xuefan ; Liu, Yong

  • Author_Institution
    Fairchild-ZJUT Microelectron. Packaging Joint Lab., Zhejiang Univ. of Technol., Hangzhou
  • fYear
    2008
  • fDate
    9-12 Dec. 2008
  • Firstpage
    1137
  • Lastpage
    1143
  • Abstract
    This paper studies the numerical simulation method for electromigration void incubation and afterwards void propagation based on commercial software ANSYS Multi-physics and FORTRAN code. The electronic migration formulation considering the effects of the electron wind force, stress gradients, temperature gradients, as well as the atomic concentration gradient has been developed for the electromigration failure mechanisms. Due to introducing the atomic concentration gradient driving force in atomic flux formulation, the conventional atomic flux divergence method cannot be used in the new EM algorithm. Therefore the corresponding EM atomic concentration redistribution method is proposed using FORTRAN code. A link between ANSYS and FORTRAN code is developed to transfer the data. The atomic concentration information is imported into ANSYS Multi-physics and then the atomic concentration distribution of the studied structure can be gotten. Finally, the comparison of voids generation through numerical example of a SWEAT structure with the measurement result is studied and discussed.
  • Keywords
    electromigration; internal stresses; voids (solid); ANSYS multiphysics; FORTRAN code; atomic concentration gradient; electromigration analysis; electromigration void incubation; electron wind force; multiple driving forces mechanism; stress gradients; temperature gradients; void propagation; Algorithm design and analysis; Atomic measurements; Current density; Electromigration; Electrons; Equations; Integrated circuit modeling; Temperature; Thermal force; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2117-6
  • Electronic_ISBN
    978-1-4244-2118-3
  • Type

    conf

  • DOI
    10.1109/EPTC.2008.4763582
  • Filename
    4763582