DocumentCode
2520387
Title
A New Algorithm for EM Analysis Considering Multiple Driving Forces Mechanism
Author
Liang, Lihua ; Zhang, Yuanxiang ; Chen, Xuefan ; Liu, Yong
Author_Institution
Fairchild-ZJUT Microelectron. Packaging Joint Lab., Zhejiang Univ. of Technol., Hangzhou
fYear
2008
fDate
9-12 Dec. 2008
Firstpage
1137
Lastpage
1143
Abstract
This paper studies the numerical simulation method for electromigration void incubation and afterwards void propagation based on commercial software ANSYS Multi-physics and FORTRAN code. The electronic migration formulation considering the effects of the electron wind force, stress gradients, temperature gradients, as well as the atomic concentration gradient has been developed for the electromigration failure mechanisms. Due to introducing the atomic concentration gradient driving force in atomic flux formulation, the conventional atomic flux divergence method cannot be used in the new EM algorithm. Therefore the corresponding EM atomic concentration redistribution method is proposed using FORTRAN code. A link between ANSYS and FORTRAN code is developed to transfer the data. The atomic concentration information is imported into ANSYS Multi-physics and then the atomic concentration distribution of the studied structure can be gotten. Finally, the comparison of voids generation through numerical example of a SWEAT structure with the measurement result is studied and discussed.
Keywords
electromigration; internal stresses; voids (solid); ANSYS multiphysics; FORTRAN code; atomic concentration gradient; electromigration analysis; electromigration void incubation; electron wind force; multiple driving forces mechanism; stress gradients; temperature gradients; void propagation; Algorithm design and analysis; Atomic measurements; Current density; Electromigration; Electrons; Equations; Integrated circuit modeling; Temperature; Thermal force; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location
Singapore
Print_ISBN
978-1-4244-2117-6
Electronic_ISBN
978-1-4244-2118-3
Type
conf
DOI
10.1109/EPTC.2008.4763582
Filename
4763582
Link To Document