Title :
Electromigration Reliability with Respect to Cu Content in Solder Joint System
Author :
Lai, Yi-Shao ; Song, Jenn-Ming
Author_Institution :
Central Labs., Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan
Abstract :
Observations from assorted current stressing experiments on flip-chip solder joints imply that the Cu content in a solder joint system plays a dominant role in its electromigration reliability. In this paper, electromigration reliability of various flip-chip solder joint systems including different substrate pad finishes and solder compositions is summarized to demonstrate the effect of the Cu content. A unified failure mechanism is proposed based on morphologies observed in the current-stressed solder joints with different substrate pad finishes and different solder compositions.
Keywords :
copper; electromigration; flip-chip devices; reliability; solders; Cu; assorted current stressing experiments; electromigration reliability; flip-chip solder joint systems; morphologies; substrate pad finishes; unified failure mechanism; Bonding; Current; Electromigration; Flip chip solder joints; Gold; Metallization; Packaging; Soldering; Temperature; Testing;
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
DOI :
10.1109/EPTC.2008.4763586
