Yield Study of Inline Package on Package (PoP) Assembly

Author

Xie, Dongji ; Geiger, David ; Shangguan, Dongkai ; Hu, Billy ; Sjöberg, Jonas

Author_Institution

Flextronics Int., San Jose, CA, USA

fYear

2008

fDate

9-12 Dec. 2008

Firstpage

1202

Lastpage

1208

Abstract

This study is focused on the correlation between warpage of ball grid array (BGA) components and the yield of package-on-package (PoP) assembly on printed circuit board (PCB). Gap analysis and modeling have been employed to address the solder joint "open" defects. Warpage measurements for BGAs were performed under simulated reflow conditions. A yield prediction model is proposed based on modeling of the gap using Monte Carlo simulation. The root causes for yield loss have been identified from this study and recommendations are made to enhance the inline assembly yield for PoP.

Keywords

Monte Carlo methods; assembling; ball grid arrays; printed circuits; BGAs; Monte Carlo simulation; ball grid array; gap analysis; open defects; package-on-package assembly; printed circuit board; solder joint; warpage; yield prediction model; Assembly; Circuit simulation; Copper; Electronics packaging; Flexible printed circuits; Performance analysis; Performance evaluation; Predictive models; Semiconductor device modeling; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th

Conference_Location

Singapore

Print_ISBN

978-1-4244-2117-6

Electronic_ISBN

978-1-4244-2118-3

Type

conf

DOI

10.1109/EPTC.2008.4763593

Filename

4763593