Title :
Yield Study of Inline Package on Package (PoP) Assembly
Author :
Xie, Dongji ; Geiger, David ; Shangguan, Dongkai ; Hu, Billy ; Sjöberg, Jonas
Author_Institution :
Flextronics Int., San Jose, CA, USA
Abstract :
This study is focused on the correlation between warpage of ball grid array (BGA) components and the yield of package-on-package (PoP) assembly on printed circuit board (PCB). Gap analysis and modeling have been employed to address the solder joint "open" defects. Warpage measurements for BGAs were performed under simulated reflow conditions. A yield prediction model is proposed based on modeling of the gap using Monte Carlo simulation. The root causes for yield loss have been identified from this study and recommendations are made to enhance the inline assembly yield for PoP.
Keywords :
Monte Carlo methods; assembling; ball grid arrays; printed circuits; BGAs; Monte Carlo simulation; ball grid array; gap analysis; open defects; package-on-package assembly; printed circuit board; solder joint; warpage; yield prediction model; Assembly; Circuit simulation; Copper; Electronics packaging; Flexible printed circuits; Performance analysis; Performance evaluation; Predictive models; Semiconductor device modeling; Soldering;
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
DOI :
10.1109/EPTC.2008.4763593
