Title :
Dicing Saw Process Study on Wafer Which Has Thick Aluminum Pads on the Scribe Street
Author :
Luo, JunHua ; Li, Ting ; Yao, Jinzhong
Author_Institution :
Freescale Semicond. (China) Ltd., Tianjin, China
Abstract :
In this paper, dicing saw process on the wafer has thick Aluminum pads on the scribe street is studied. Thick Aluminum pads wafer has bad topside chipping at Aluminum pads and the chipping out of specification limit is about 3.0%. New blade and dicing saw process are introduced to solve this issue. According the evaluation results, optimized recipe can solve the bad topside chipping on the Aluminum pads and the yield loss is zero. Backside chipping and blade life also are evaluated to ensure without additional cost.
Keywords :
aluminium; sawing; semiconductor technology; Al; backside chipping; blade life; dicing saw process; scribe street; thick aluminum pads; topside chipping; yield loss; Aluminum; Blades; Costs; Delamination; Inspection; Production; Silicon; Size control; Thickness control; Wafer bonding;
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
DOI :
10.1109/EPTC.2008.4763602
