Two types of interconnection designs and measurements for broadband packaging

The present article contains the description of two types of wide band interconnections used as package feedthroughs. Interconnections are typically made of insulator materials with conductive structure which have been optimized for bandwidth ranging in the DC to 45 GHz. Based on glass to metal sealing and thin film substrate technology, the first design is the assembly of a K^® connector and a Coplanar Waveguide circuit (CPW). The second one relies on High Temperature Cofired Ceramic technology (HTCC). Screen printed metal lines on multilayered alumina allow planar propagation on the surface and in the substrate. For this two types of interconnection, we propose innovative and cost effective measurement methods to estimate the electrical performance and characterize hermetic feedthroughs. The connector option is better than 10 dB return loss up to the K^® bead cut off at 49 GHz. While the ceramic differential feedthrough exhibits less than 15 dB return loss up to 14 GHz. We also present results of electro optical bandwidth measurement associated with 10 Gb/s module and this type of feedthroughs for telecom industry.