Title :
Process and Reliability of Copper Column Flexible Flip Chip Connection (F2C2)
Author :
Lin, Ta-Hsuan ; Andros, Frank ; Lu, Siyu ; Sammakia, Bahgat
Author_Institution :
Dept. of Syst. Sci. & Ind. Eng., State Univ. of New York, Binghamton, NY, USA
Abstract :
This paper addresses a new flip chip interconnect technique - Flexible Flip Chip Connection (F2C2) technology and its initial reliability study. F2C2 utilizes copper columns instead of solder balls as the electrical and mechanical interconnections between the semiconductor chip and the substrate. In this study, Accelerated Thermal Cycling (ATC) tests were performed on F2C2 components as well as C4 and underfill C4 components in an air-to-air thermal shock chamber. The test results were assessed and compared.
Keywords :
flip-chip devices; integrated circuit interconnections; integrated circuit reliability; monolithic integrated circuits; thermal shock; accelerated thermal cycling; air-to-air thermal shock chamber; copper column flexible flip chip connection; electrical interconnections; mechanical interconnections; reliability; semiconductor chip; Assembly; Copper; Fatigue; Flip chip; Packaging; Substrates; Testing; Thermal stresses; Vehicles; Wires;
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
DOI :
10.1109/EPTC.2008.4763613
