DocumentCode :
2521113
Title :
Chemical milling of quartz using a solution based on organic solvents and anhydrous hydrofluoric acid
Author :
Neumeier, David A.
Author_Institution :
XECO Inc., Cedar City, UT, USA
fYear :
2002
fDate :
2002
Firstpage :
394
Lastpage :
402
Abstract :
The use of hydrofluoric acid solution in chemically milling, etching and polishing quartz has been accepted for many years. Several papers have been presented addressing aqueous HF solutions. In this paper the use of a solution based on organic solvents and anhydrous HF to chemically mill or etch mesa structures in quartz plates is investigated. The etch rate figures and how they are affected by the molarity of the solution, temperature, quartz cut angle and water concentration have been studied. Based on data collected by several tests, the parameters of etch rate relative to cut angle, temperature and solution concentrations has been determined. From this data, mathematical equations defining the chemical mechanisms have been developed and are presented in this paper. These equations are further verified by comparing predicted results to actual data gathered from a mesa-blank production line.
Keywords :
chemical reactions; etching; hydrogen compounds; machining; organic compounds; polishing; quartz; temperature; HF; SiO2; anhydrous HF; chemical etching; chemical mechanisms; chemical polishing; etch rate figures; hydrofluoric acid; lattice etch; mesa-blank production line; organic solvents; quartz chemical milling; quartz cut angle; quartz plate mesa structures; solution molarity; solution temperature; water concentration; Chemistry; Equations; Etching; Hafnium; Milling; Organic chemicals; Production; Solvents; Temperature; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Frequency Control Symposium and PDA Exhibition, 2002. IEEE International
Print_ISBN :
0-7803-7082-1
Type :
conf
DOI :
10.1109/FREQ.2002.1075915
Filename :
1075915
Link To Document :
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