Title :
A Numerical Simulation Study on Wetting and Bridging of SnAgCu Solder Liquid
Author :
Zhang, Lei ; Wang, Dong ; Tong, Weiping
Author_Institution :
Shenyang Nat. Lab. for Mater. Sci., Chinese Acad. of Sci., Shenyang
Abstract :
With size and pitch of the solder pad decreasing, solder bridging become one of the most common and critical defect in the high-density assembly process. Optimized geometry of solder with its pad is the guarantee of manufacturing process. By means numerical simulation technology, the wetting behavior of SnAgCu solder liquid on structured surface consisting of solder pad and solder mask was investigated. The solder liquid separation condition, that the solder height must below one and third quarter of the width of nonwetting zone, was verified. The simulation results demonstrate the validity of the criteria.
Keywords :
assembling; copper alloys; fine-pitch technology; finite element analysis; silver alloys; soldering; tin alloys; wetting; FEM analysis; SnAgCu; high-density assembly process; nonwetting zone width; numerical simulation technology; optimized solder geometry; solder bridging; solder liquid separation condition; solder liquid wetting behavior; solder mask; solder pad pitch; solder size; Assembly; Bridges; Energy states; Finite element methods; Geometry; Laboratories; Numerical simulation; Shape control; Soldering; Surface morphology;
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
DOI :
10.1109/EPTC.2008.4763618
