DocumentCode :
2521151
Title :
Ground plane SOI MOSFET based SRAM with consideration of process variation
Author :
Saremi, Mehdi ; Ebrahimi, Behzad ; Afzali-Kusha, Ali
Author_Institution :
Nanoelectron. Center of Excellence, Univ. of Tehran, Tehran, Iran
fYear :
2010
fDate :
15-17 Dec. 2010
Firstpage :
1
Lastpage :
4
Abstract :
In this paper, the characteristics of static random access memory (SRAM) cells based on three silicon-on-insulator (SOI) device structures are studied using device simulations. The comparative study, which is performed in a 32nm standard CMOS technology, includes read static noise margin (read SNM), read current, and standby power. The structures include SOI with ground plane in substrate (SOI-GPS), SOI with ground plane in buried oxide (SOI-GPB), and SOI without ground plane (SOI-WGP). In addition, the variations of the SRAM characteristics due to channel length and thin-film thickness variations are investigated. The results show that the SOI-GPS structure is more resistant against the process variations when compared to the other two structures.
Keywords :
CMOS digital integrated circuits; MOSFET; SRAM chips; silicon-on-insulator; SRAM; channel length; device simulations; ground plane SOI MOSFET; ground plane in buried oxide; process variation; read current; read static noise margin; silicon-on-insulator device structures; size 32 nm; standard CMOS technology; standby power; static random access memory cells; thin-film thickness variations; CMOS integrated circuits; Logic gates; MOSFET circuits; Nanoscale devices; Noise; Random access memory; Threshold voltage; Silicon-on-insulator (SOI) MOSFET; ground plane (GP); process variations; static random access memory (SRAM) cell;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices and Solid-State Circuits (EDSSC), 2010 IEEE International Conference of
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-9997-7
Type :
conf
DOI :
10.1109/EDSSC.2010.5713733
Filename :
5713733
Link To Document :
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