Title :
Reliability Assessment of Lead-Free Universal Solder for Direct Bonding in Power Electronics Packaging
Author :
Ibitayo, Dimeji ; Everhart, Lauren ; Morgenstern, Mark ; Geil, B.R. ; Mitchell, James W.
Author_Institution :
U. S. Army Res. Lab., Adelphi, MD, USA
Abstract :
A novel, lead-free universal (rare earth) solder is investigated for high temperature power electronics packaging. The material is Sn-3.5Ag-0.5Cu solder with small additions of a rare earth element exhibiting superb bonding properties. It is capable of direct, reliable bonding of dissimilar materials without the use of flux and eliminates the need for multilayer metallization which is typically required to aid in wetting. The problem of surface oxidation is done away with because of the strong thermodynamic affinity of the rare earth metal in the solder to oxygen. [1] This paper offers a first investigation of the thermal performance and reliability of this universal solder joint for power switching applications.
Keywords :
alloying additions; bonding processes; copper alloys; electronics packaging; reliability; silver alloys; soldering; solders; tin alloys; SnAgCuJk; direct bonding; dissimilar materials; high temperature power electronics packaging; lead-free universal solder; multilayer metallization; power switching; rare earth element; reliability; solder joint; surface oxidation; thermodynamic affinity; Bonding; Electronics packaging; Environmentally friendly manufacturing techniques; Inorganic materials; Lead; Materials reliability; Metallization; Nonhomogeneous media; Power electronics; Temperature;
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
DOI :
10.1109/EPTC.2008.4763621
