Title :
Effect of Impact Rate on the Strength of Lead-free Solder Joints
Author :
Huang, L. ; Lin, K.L. ; Liu, D.S.
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Abstract :
The joint strength of Sn37Pb, Sn-lAg-0.5Cu (SAC105), Sn-3Ag-0.5Cu (SAC305) and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga (SnZn-5e) solder joints on Au/Ni/Cu and OSP/Cu metallization were investigated with micro-impact test. All solder joints exhibit bulk and interfacial fracture modes except Sn37Pb of which fracture only occurs in the bulk. The impact resistance is governed by strain rate. Sn37Pb, SAC105 and SnZn-5e solder joints reveal a proportional correlation with respect to impact rate. SAC305 solder joint shows a maximum impact resistance at an impact rate of 650 mm/sec. The existence of maximum impact resistance is ascribed to the competition between bulk and interfacial fracture modes.
Keywords :
copper; copper alloys; couplings; fracture; gallium alloys; gold; impact strength; lead alloys; metallisation; nickel; silver alloys; solders; tin alloys; zinc alloys; Au-Ni-Cu; SnAgCu; SnPb; SnZnAgGa; impact resistance; interfacial fracture modes; joint strength; lead-free solder joints; metallization; micro-impact test; Capacitive sensors; Copper alloys; Environmentally friendly manufacturing techniques; Lead; Optical microscopy; Packaging; Scanning electron microscopy; Soldering; Temperature; Testing;
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
DOI :
10.1109/EPTC.2008.4763622
